Wire bonding is the method of making interconnections between a device and the external circuit. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Thermosonic and ultrasonic modes are usually employed to melt the microwire on specific metallized zones of the device, called metal pads.
At the DiaTHEMA Lab of the Montelibretti Section, the Kulicke & Soffa mod. 4123 is an Al/Si and Au wire wedge bonder that can be used for bonding devices ranging from simple Integrated Circuits (ICs) to discrete devices up to complex hybrids.
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