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Tempism
Prototyping
Microtechnology
Optical lithography
Two optical lithography techniques are available: 1) Ultraviolet lithography also known as photolithography, which is the most common used patterning
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Micro and nanomachining
Micro and nanomaching of materials and devices are performed with techniques that physically modify their surface and/or the bulk, such
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ElectroSpray Deposition
The Electrospray Ionization (ESI) technique, allows to bring large molecules as intact and isolated units in the gas phase. Its
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Contact metallization
The metallization technique is usually aimed at (but not limited to) the fabrication of electrical contacts of prototypes and devices
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Microwire bonding
Wire bonding is the method of making interconnections between a device and the external circuit. Wire bonding is generally considered
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